Report on Recent Developments in Topology Optimization and Advanced Lithography

General Direction

The field of topology optimization is witnessing significant advancements, particularly in the integration of parallel computing techniques and the design of thermal meta-structures using functionally graded materials (FGMs). Innovations in the application of parallel-in-time methods, such as the Parareal algorithm, are being explored to enhance the efficiency of topology optimization for transient heat conduction problems. Additionally, the use of isogeometric analysis in conjunction with density-based topology optimization is proving to be a powerful tool for designing complex thermal meta-structures, showcasing the versatility and effectiveness of this approach.

In the realm of advanced lithography, particularly triple patterning lithography (TPL), there is a growing focus on developing methods that reduce color conflicts and stitches while improving routing efficiency for multi-pin nets. These advancements aim to address the challenges of mask assignment and layout decomposition in TPL, thereby enhancing the overall performance and feasibility of this lithography technique.

Noteworthy Papers

• One-shot Parareal Approach for Topology Optimisation of Transient Heat Flow: Introduces a novel one-shot approach combining Parareal with the Method of Moving Asymptotes, achieving a 5x speedup in transient heat conduction optimization.
• Design of thermal meta-structures made of functionally graded materials using isogeometric density-based topology optimization: Demonstrates the effectiveness of isogeometric analysis in designing complex thermal meta-structures, offering a flexible and versatile approach to topology optimization.
• Mr.TPL: A Method for Multi-Pin Net Router in Triple Patterning Lithography: Proposes a method that significantly reduces color conflicts and stitches in TPL, achieving a 5.4x speed improvement over state-of-the-art methods.